Solder Wave Masking Discs are made of 4 mil thick creped back paper with rubber adhesive. They can withstand 5 to 8 seconds of solder wave exposure up to 510°F (266°C) without adhesive transfer. Solder Wave Masking Discs can be removed cleanly without leaving any residue.
- General Purpose Masking
- Heat Insulation
- Protection of circuit board during wave solder
- Powder Coating